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Ball Grid Array Rework and Soldering Services

MPN Tech provides specialised support for ball grid array rework, helping restore functionality and reliability in complex electronic assemblies. Our approach to BGA soldering focuses on precise component handling, controlled reflow, and accurate alignment, ensuring secure connections while minimising impact on surrounding components during repair or rework.
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What Is Ball Grid Array Rework and BGA Soldering?

Ball grid array rework and BGA soldering are specialised processes used to repair, replace, or restore connections on BGA components, where solder joints are located beneath the chip rather than around its perimeter. These processes are commonly required when faults arise due to thermal cycling, mechanical stress, ageing, or manufacturing defects.

Although closely related, each process serves a different purpose within electronics repair and assembly:

  • Ball Grid Array Rework involves removing an existing BGA component from the PCB, cleaning and preparing the solder pads, and reinstalling either the original component or a replacement. This process is used to address failed solder joints, misalignment, or component-level defects while preserving the surrounding circuitry.
  • BGA Soldering refers to the controlled reflow process that forms reliable solder joints between the BGA component and the PCB. It is applied during initial assembly or as part of ball grid array rework to ensure each solder ball bonds correctly and consistently to the board.

Both processes require accurate temperature profiling, precise placement, and thorough inspection to maintain board integrity. When performed correctly, ball grid array rework and BGA soldering help extend the service life of electronic assemblies and restore stable electrical performance without full board replacement.

Our Ball Grid Array Rework and Reballing Process

MPN Tech follows a controlled, step-by-step approach to ensure ball grid array rework and reballing are carried out with accuracy and minimal risk to surrounding components. Each stage is designed to restore reliable connections while maintaining overall board integrity.

Initial Inspection and Fault Assessment

The process begins with a detailed inspection to identify solder joint failures, alignment issues, or component-related defects. This assessment helps determine whether rework, reballing, or full component replacement is required.

Controlled BGA Component Removal

The BGA component is removed using carefully managed temperature profiles to avoid board damage or pad lifting. Precision control at this stage is essential to protect adjacent components and the PCB substrate.

Pad Cleaning and Site Preparation

Residual solder is removed from both the PCB pads and the component site. Proper cleaning ensures a flat, contamination-free surface, which is critical for successful reattachment during rework or reballing.

Reballing of the BGA Component

For reballing, new solder balls are applied to the underside of the BGA component using aligned stencils and controlled heating. This step restores uniform solder ball size and spacing before reinstallation.

Component Reattachment and Reflow

The reballed or replacement component is accurately aligned and reattached to the PCB. Controlled BGA soldering ensures consistent reflow across all solder joints, supporting stable electrical connections.

Inspection and Functional Verification

Final inspection checks solder joint quality, alignment, and overall workmanship. Where required, functional testing is carried out to confirm the reworked board performs as intended before return or reintegration.

Our BGA Soldering Process

MPN Tech applies a structured approach to BGA soldering to ensure consistent joint quality and minimise risk to complex PCB assemblies. Each stage focuses on precision, thermal control, and alignment to support reliable electrical performance.

Board and Component Preparation

The PCB and BGA component are prepared by checking pad condition, cleanliness, and alignment markers. Proper preparation helps reduce solder defects and supports stable reflow during the soldering process.

Solder Paste Application

Solder paste is applied evenly to the PCB pads using controlled methods to ensure uniform volume and coverage. Consistent paste application is critical for forming reliable solder joints beneath the BGA component.

Precise Component Placement

The BGA component is positioned using alignment systems that ensure accurate placement over the pads. Correct alignment at this stage helps prevent bridging, opens, and misaligned joints after reflow.

Controlled Reflow Soldering

The assembly is passed through a controlled reflow profile that gradually raises and lowers temperature. This allows solder to melt and solidify evenly across all joints, supporting strong electrical and mechanical connections.

Cooling and Stress Management

After reflow, controlled cooling is used to reduce thermal stress on the PCB and component. Proper cooling helps prevent microcracks and long-term reliability issues.
Post-Soldering Inspection
The final stage involves inspection to verify solder joint integrity, alignment, and overall workmanship. Inspection helps confirm the BGA soldering process has produced stable and reliable connections.

Our Ball Grid Array Rework Capabilities

MPN Tech offers a range of specialised capabilities to support ball grid array rework across different board types, component sizes, and application requirements. Each capability is focused on restoring connection integrity while protecting overall PCB reliability.

Automated Reballing Services

Automated reballing is used to restore uniform solder ball size and placement on BGA components. This helps improve consistency and reduces variability during reinstallation and reflow.

Custom Thermal Profiling

Thermal profiles are tailored based on board thickness, component type, and material composition. Custom profiling helps control heat exposure and reduces the risk of pad damage or component stress during rework.

X-Ray and AOI Inspection

X-ray and automated optical inspection are used to evaluate solder joints that are not visible from the surface. These inspection methods help identify voids, bridging, or alignment issues after rework or soldering.

Small-Volume Prototyping and High-Volume Rework

Support is available for both small prototype batches and larger rework volumes. This flexibility allows teams to address isolated failures or broader quality issues without changing processes or vendors.

Trace and Pad Repair for Damaged PCBs

Damaged traces or lifted pads can be repaired as part of the rework process. These repairs help restore electrical continuity and allow boards to remain usable rather than being fully replaced.

Industries We Support

MPN Tech supports a range of industries that rely on ball grid array rework and BGA soldering to maintain functionality, extend product life, and reduce unnecessary board replacement. Each industry is supported with processes aligned to its operational and reliability requirements.

Medical Devices

Medical devices often involve compact, high-density electronics where BGA components are common. Rework services help address solder joint failures or component issues while preserving sensitive boards used in diagnostic and monitoring equipment.

Military and Aerospace Electronics

Military and aerospace systems require high reliability under demanding conditions. Ball grid array rework supports repair and recovery of complex boards while maintaining strict alignment and inspection standards.

Telecommunications

Telecommunications infrastructure relies on stable signal transmission and continuous uptime. BGA rework and soldering services help restore failed connections in network equipment and communication modules.

Automotive ECU Modules

Automotive electronic control units are exposed to vibration and thermal cycling that can stress solder joints. Rework services support fault resolution and extend the service life of ECU boards.

Industrial Control Systems

Industrial control electronics often operate continuously in harsh environments. Ball grid array rework helps correct connection failures without full system replacement, supporting operational continuity.

Consumer Electronics Prototyping

Prototype and early production consumer electronics frequently require design adjustments or component replacement. Rework services support fast iteration and refinement during development cycles.

Why Choose MPN Tech for Ball Grid Array Rework and Soldering

MPN Tech provides focused expertise in ball grid array rework and BGA soldering, helping organisations recover complex boards with care and technical precision. Our approach prioritises controlled processes, skilled handling, and practical outcomes.

IPC-Certified Rework Technicians

Rework is carried out by technicians trained to IPC standards, supporting consistent workmanship and adherence to recognised industry practices. This helps ensure rework is performed with appropriate control and documentation.

Custom Jigs for Complex Board Handling

Custom fixtures and jigs are used to support boards with unusual shapes, sizes, or component density. These tools help stabilise assemblies during rework and reduce mechanical stress on sensitive areas.

High Success Rate for Salvaged Components

Controlled removal, reballing, and reattachment processes help maximise the chances of successfully salvaging BGA components. This can reduce replacement costs and lead times for hard-to-source parts.

Quick Turnaround for Urgent Repairs

Rework workflows are structured to support urgent repair requirements where possible. This helps minimise downtime and supports faster recovery for critical systems.

Cost-Effective Alternative to Full PCB Reassembly

Ball grid array rework offers a practical alternative to full board replacement or reassembly. It allows faulty components or solder joints to be addressed directly, reducing waste and overall repair costs.

Frequently Asked Questions

What is ball grid array rework used for?

Ball grid array rework is used to repair or replace BGA components on a PCB when solder joints fail or components become defective. It allows targeted correction without replacing the entire board, which helps reduce cost and downtime. This process is commonly applied in high-density and high-value electronic assemblies.

BGA soldering refers to the reflow process that forms solder joints between a BGA component and the PCB. Reballing involves removing old solder balls from a BGA component and applying new ones before reinstallation. Reballing is often performed as part of ball grid array rework when existing solder balls are damaged or inconsistent.
When carried out with proper thermal control, alignment tools, and inspection, ball grid array rework can be performed safely on complex PCBs. Careful handling helps minimise risk to nearby components and board layers. This is why specialised equipment and trained technicians are important.
Inspection is typically performed using X-ray imaging and automated optical inspection where applicable. These methods allow technicians to assess solder joint integrity, alignment, and potential voids that are not visible on the surface. Inspection helps confirm the success of the rework or soldering process.
Turnaround time depends on board complexity, component type, and whether reballing or pad repair is required. Simple rework jobs may be completed within a short timeframe, while more complex repairs take longer. Timelines are usually confirmed after initial inspection and assessment.